From: Mike Fenner, BSP 100760,[log in to unmask] Fax: +441 295 720 937 For a project: I would be interested to hear from anyone who has knowledge of specifications/procedures for determining the maximum amount of entrapped air in pastes (solder, adhesives or otherwise) as supplied and methods for measuring same. I am concerned with all aspects, eg possible effects on rheology of beaten in air/gas, as well as gross bubbles in syringes. Alternatively suggestions for measuring techniques and max limits for "packaged air" particularly would be welcome.