We receive questions about plating high Z axis expansion board materials. When the expansion from assembly soldering is too great, surface pads around the holes lift, or the plated barrel cracks. Does anyone have a standard practice to prevent these phenomena when using laminate with great amounts of Z axis expansion (we think more than 6%)? Thicker plating in the hole? Alternate metals plated? Dennis Fritz MacDermid, Inc. 245 Freight Street Waterbury CT 06702 Phone 203-575-5740