1. When wavesoldering with no-clean flux and nitrogen, solder balls seem to be a common problem. While solder mask is part of the problem I have found that the lead length of connectors, sip's and other inline componets have the greatest effect on solder ball production. By cutting the leads to .080-.085 from the standard length of .110-.120 we can eliminate the solder balls. The problem is that you can not buy connectors and other components at the storter lead length. The manufactures claim no one is asking for shorter leads. I have not been able to find any documentation that backs up my claim. If you have the same requirement or have a article about lead length and solder balls please let me hear from you. 2. IPC. Do you know about this? Have you done any testing? I believe that we need a lead length spec for the no-clean process. Electrovert knows that this is a problem and so do most of the people I have talked with at the major flux companies. Can IPC help?