I have redistributed this E-mail, I had failed to include my return electronic mailing address. I am very anxious to hear any responses: We have recently experienced an unusual occurence in four lots of hardware. We have seen lifted pads, cracked internal foil (n-1) and plating separations. The boards have ranged from eight to twelve layers and run approximately 0.066 to 0.074 inch thick. These are not unusual or complex designs just standard plated-through hole technology. We are using difunctional 0.055 and 0.012 laminate predominantly one ounce, one board two ounce. We procure our laminate with HTE on all internals and standard ED for externals. We had made this change approximately 6-7 years ago and have not seen a crack since on internals. We tried everything under the sun and couldn't get the HTE to crack. As most of you know we are experiencing a labor dispute and our production has been limited. We have seen this on small number of lots but if we were in full production we could have a major disaster. During microsectioning we have also seen some grain structure variance in the appearance of the HTE copper. The laminate and foils have been verified to be HTE according to the vendors. We have performed Tg testing (133 to 141), plating ranges from 0.016 to 0.023 in the hole, elongation from 16.0 to 20.0%, tensile strength, temperature exposure and we can find no concrete defect cause. The vendor has reported a phenomenon "Stress Grain Boundary Condition" which they are looking for the report. Does anyone have a input on the causes, identification or corrective action for this "condition"???? I really could use some input and assistance. Please respond ASAP!!! Boeing Defense and Space Group Roxanne Tovey (206) 773-7336 Address: [log in to unmask]