Generally non-functional lands should be included in the pad stack for multilayer boards. This is primarily a reliability issue. Results from the IPC small hole round robin program indicated failure in small holes in the resin rich areas. By leaving the non-functional lands in the stack, you reduce the resin rich areas around the holes. However, when laminating high layer count boards, all the lands tend to present a compression problem. Therefore, it is advisable to remove some of the lands in the stack. It is suggested to balance the removal in the z-axis. Gary Ferrari Tech Circuits