In reference to Ni-Pd finished IC leads, the HDP Users group (specifically the Telecom Working Group) was formally addressed in the October meeting by a number of IC suppliers (TI, National, AMD, Amkor, and others) about the acceptability of this finish in addition to Tin-lead. Much discussion followed the final concensus was - briefly condensed as follows: Ni-Pd does not perform as well in solderability testing using wetting balance or other techniques. This also shows up visually making solder joints appear "dry" since they do not wet to the same degree. Some of the companies expressed how this was causing them problems today. The only data presented by TI on solder joint quality was solder joint strength testing which has no bearing on long term reliability of the solder joint. The criteria required by all was N-50 thermal cycle data. The final resolution came down to: z The Telecom Working Group today accepts Ni-Pd lead finishes from TI, not because we want to, but because we have to - or live without parts. z Assuming reliability data is good, we would rather have "all" Ni-Pd rather than mix parts with Tin-lead, such that the inspection criteria can be consistent. z Reliability data is really insufficient on this lead finish and needs to be provided and presented to the group. TI will review to see if they have the N-50 data for thermal cycling. z The method for testing this should be per the criteria for new package qualification being defined by the BGA subcommittee - see above. Joe Smetana DSC Communications All opinions expressed here are soley my own and do not necessarily reflect the position of DSC Communications. ______________________________ Reply Separator _________________________________ Subject: Palladium plated IC leads. Author: GEILAND at DSC-1100 Date: 10/27/95 07:59 AM Joe: Wasn't this an issue at the HPD user's conference? Ge ______________________________ Forward Header __________________________________ Subject: Palladium plated IC leads. Author: [log in to unmask] at SMTPLINK Date: 10/26/95 14:29 The appearance of the palladium plated lead IC solder joints continues to create anxieties with our customers. This occurs because they see a solder connection profile which is different than would result from a pb/sn plated lead connection. Texas Instruments has published a booklet demonstrating and discussing the differences, but this is not completely sufficient to convince some of our customers. Is there any 'work in progress' material available from IPC and/or other sources which can be used to graphically educate auditors and customers about acceptable appearances of palladium plated lead solder joints? Now our auditors and customers reference the IPC-A-610 Rev. B manual. Thank you. Myron Papiz MSL