Hello, I am wondering what are your experiences with the requirements on HASL finish on 0.5mm PAD pitch devices. We have observed that variations in HASL finish height will cause either opens or shorts on the 0.5mm pads. The shorts may be attributed to having a poor gasket seal between the PCB and screen print stencil. This seal is poor because of the variation in HASL finish within the same footprint when using no snap off. During the screen printing process, the solder paste tends to leak out the sides of the footprint and may result in PAD to PAD shorts after reflow. We also experience opens again due to variations in HASL finish height. We find that problems occur when PAD to PAD solder level finish variation within the same device footprint is in the order of 400 micro inches. We are putting down 6 thou of solder paste. Has anyone out there had similiar experiences? Rgds, Tony. (Supplier Quality Engineer PCB's).