From: Kelly Kovalovsky, PCB Quality Engineering ~ EMail:[log in to unmask] Subject: PCB vs. Paste Stencil Comp We have a fairly large circuit board that we are assembling. The card has fine pitch SMT at extreme ends. We have noticed a mismatch between the solder paste stencil and the printed circuit board. The circuit board features are actually closer together than the stencil. My question to any card assembly site is whether it is common practice to compensate a solder paste stencil for shrinkage of a PCB? IBM Microelectronics Division 6800 IBM Drive MG12/251 Charlotte, NC 28262-8563