As an OEM, we have recently had a customer impose on us MIL-STD-1547. That document requires we test a minimum of three SMT lands per IPC-TM-650, Method 2.4.21 after subjecting the samples to 5 soldering and 4 desoldering cycles. The land shall withstand 500 psi of vertical pull. The product we are designing/procuring has standard chip cap components, as well as some .020 inch quad packs. The PWB laminate is polyimide. We procure a lot of polyimide PWBs, most of which have surface mount components. We have never had a problem with respect to lifted or peeling SMT lands. As this is a test we've never imposed on our PWB suppliers, my questions include: 1) Is the test valuable? What does it demonstrate? 2) Is the 500 psi pull limit reasonable? For all pad sizes? 3) Would results be more or less favorable on FR4 laminates? 4) How frequently should this be tested? (I know what IPC-RB276 - 2 times per month for class 3 - but wouldn't it be primarily laminate lot dependant?) My company won't mind spending the extra money on testing if there is a benefit in doing so. But, I'm not clear on the added benefit this test will provide. Thank you for any insights. Andy Pedersen Harris Corp. [log in to unmask]