Does anyone know of good references for determining the maximum current carrying capacity of traces of different trace widths and copper weights. I've seen the tables in IPC-D-275, but am looking for more extensive information. I'm also interested in knowing if there are empirical equations describing max current. Additionally I need to know the same information for vias. For a given hole size and minimum plating thickness what is the maximum current carrying capacity of a via. Is this affected by the use of thermals on power and ground layers. Is this affected by whether the via is bare copper, HASL coated, or solder filled? I'd appreciate any inputs? Thanks, Thad McMillan Dell Computer [log in to unmask] Ph # 512-728-5240