We are having some problems soldering to an electroless gold over nickel card. specifics are: 5-10 microinches electroless gold over 20 microinches electroless nickel. .020 thick double sided smt card being soldered in a nitrogen covection reflow oven. components range from 0603-1206 passives, sot 23 devices, and a 25 mil ssop. Soldering is being done using Alpha 609 water soluble 63/37 paste with a fairly standard profile. Results thus far are that the joints are granular, cold appearing, with marginal wetting to both card and components. There are also numerous occurrances of voids/pinholes eminating from the lead pad interface. Any insights would be helpful in the areas of: Profiles Pastes Methods for checking incoming solderability of the cards. Any thoughts on optimal gold/nickel characteristics Thanks for the help. Steve Ethier Mgr. New Product Engineering Lockheed Martin Commercial Electronics Tel: 603-885-8432