Thermal Cycling I want to perform a non-destructive thermal cycling / thermal shock test on finished SMD PCAs (commercial/industrial computer peripherial add-on PCAs) that will: a) sufficiently stress weak solder joints to failure, so that they can be detected at electrical test of the PCA AND b) not damage any of the installed components, thus inducing further reliability problems into the equation. I have access to an ESS chamber with a maximum temperature ramp rate of 18 degrees C per min. The operating temperature for the PCA os 0-70 degrees C. What is the most effective ramp rate, soak time and number of cycles to accomplish the above objectives? Other than power cycling or biased burn-in, are there any other equally effective techniques to achieve the same end result? Thanks in advance for your input. - - - - - - - - - - - - - - - - - - - Bill Fabry, Process & QA Mgr. Truevision, Inc. 2500 Walsh Avenue Santa Clara, Ca. 95051 (408) 562-4200 x366 (phone) (408) 562-4067 (FAX) e-mail: [log in to unmask] - - - - - - - - - - - - - - - - - - -