-- [ From: Douglas C. Jeffery * EMC.Ver #2.10P ] -- I recently had a customer inquire about the advantages or disadvantages of using tin/lead plating over HAL for a connector application (SIMMs). We have been 100% HAL for several years and I couldn't really answer his question other than to say we don't have a tin/lead bath...So..Are there any thoughts as to one method being preferred over the other? (note. the question is about the insertion tabs not component attachment, and he currently is not using ni/au). Thanks for any insight. Doug Jeffery Electrotek, Inc. [log in to unmask] 414-762-1390