---------- From: Crawford, John A. To: TechNet-request Subject: RE: BGA Test Manf. Samples Date: 16 Aug 95 9:35AM Following from the Electronics Manufacturing Productivity Facility (EMPF) HelpLine Coordinator in Indianapolis: TopLine, PO Box 5100, Garden Grove CA 92645 (310) 433-7000 is one source for the material you requested. Materials like this are not always cheap, even if they are "off the shelf", but the materials from TopLine are known to be good quality and readily available. Contact them directly for more info, and if you wish to contact us directly we will share our experiences in using these components and boards. In response to your second question, we have the ability to do the assembly you requested. We will be contacting you at your listed phone number with further info. Jack Crawford, EMPF HelpLine Manager (16 hours of FREE! electronics mfg. consulting), 317.226.5616 ---------- From: TechNet-request To: 'TechNet' Subject: BGA Test Manf. Samples Date: 14 Aug 95 4:38PM Return-Path: <[log in to unmask]> Resent-Date: Tue, 15 Aug 1995 18:11:38 -0500 Old-Return-Path: <miso!eag.unisysgsg.com!KTHORSON> From: "Thorson, Kevin J @EAG" <[log in to unmask]> To: "'TechNet'" <[log in to unmask]> Subject: BGA Test Manf. Samples Date: Mon, 14 Aug 95 16:38:00 CST Message-Id: <[log in to unmask]> Encoding: 11 TEXT X-Mailer: Microsoft Mail V3.0 Resent-Message-ID: <"WidXg.0.OB8.dAGCm"@ipc> Resent-From: [log in to unmask] X-Mailing-List: <[log in to unmask]> archive/latest/858 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] ---------------------------------------------------------------------------- -- I am looking for off-the-shelf printed wiring boards and ball grid array package samples (preferably ceramic) for the profiling of assembly process parameters. Also, are there any experienced assemblers willing to attach two 1mm pitch ceramic BGA's on two assemblies. Please contact: Kevin Thorson (612) 456-2639