We have always used this formula. No more than a 4" stack of boards 150 F for 4 hrs. ______________________________ Reply Separator _________________________________ Subject: PCB Pre Bake Author: [log in to unmask] at ~INTERNET Date: 9/7/95 6:33 PM Received: by ccmail Received: from netcomsv by pragma.com (UUPC/extended 1.11) with UUCP; Thu, 07 Sep 1995 18:32:48 PDT Received: from miso.wwa.com by netcomsv.netcom.com with SMTP (8.6.12/SMI-4.1) id SAA27804; Thu, 7 Sep 1995 18:03:13 -0700 Resent-Date: Thu, 7 Sep 1995 18:03:13 -0700 Received: from ipc by miso.wwa.com with uucp (Smail3.1.28.1 #8) id m0sqrtQ-000FglC; Thu, 7 Sep 95 20:06 CDT Received: by ipchq.com (Smail3.1.28.1 #2) id m0sqrH4-0000GeC; Thu, 7 Sep 95 19:26 CDT Old-Return-Path: <miso!adam.com.au!igraham> Date: Fri, 8 Sep 1995 09:49:58 +0930 (CST) From: ian graham <[log in to unmask]> X-ccAdmin: postmaster@netcomsv To: [log in to unmask] Subject: PCB Pre Bake Message-ID: <[log in to unmask]> MIME-Version: 1.0 Content-Type: TEXT/PLAIN; charset=US-ASCII Resent-Message-ID: <"TiTHR.0.44A.rsuJm"@ipc> Resent-From: [log in to unmask] X-ccAdmin: postmaster@netcomsv X-Mailing-List: <[log in to unmask]> archive/latest/1048 X-Loop: [log in to unmask] Precedence: list Resent-Sender: [log in to unmask] What time/temperature profile is suitable for FR4 and FR5 prebaking prior to assembly? Process is print, place and reflow. -------- Ian Graham [log in to unmask]