Having a problem with solder being randomly trapped under SOIC's (gull wing) and SOJ's ("J" leaded devices) on the solder side of the board after wave solder. The solder "disks" or "specks" range from .005 to .030". These can only be detected by x-ray since they show up under the body of the component. Has anyone seen this problem before or have it now.What has been done to prevent this from happening, short of not putting these devices on the solder side of the board. (This is not an option as of now) Does anyone feel this is a liability if left on the board if board passes test, and solder is trapped. (I will be doing shock & vib. testing to ensure they do not move) Any input would be appreciated. Thanks, Al Boulais [log in to unmask] (603) 337-1253