Patrick- You may also want to refer to the cover story in the May 1995 issue of SMT Magazine, "Optimum Processing Prevents PQFP 'Popcorning' ," p39, by P. Yalamanchili, R. Gannamani, R. Munamarty, P. McCluskey, and A. Christou of the CALCE Electronic Packaging Research Center of the U. of Maryland. [log in to unmask] ______________________________ Forward Header __________________________________ Subject: Popcorn; Delamination: Floating Author: [log in to unmask] at _internet Date: 8/15/95 2:58 PM I could use some assistance in defining 'popcorn effect,' delamination,' and 'floating' as it applies to components (BGA, fine pitch packages). Any other known common component level phenomena (seen during assembly/soldering) and words used to identify them would be much appreciated as well. Thank you, Patrick Hassell Electronic Packaging Services (404) 524-0888 [log in to unmask]