FROM: BRUCE HOUGHTON 27/552/844/TOR Phone (416) 448-5701 Tie 778-5701 Subject: Surface Solderability Test Jim, Re your note on Aug 15, the test may be interesting but not all encompassing. With OSP finishes, the solder paste does not flow out across the copper and knowing that, we can select the stencil aperture size and thickness and get the desired solder joint without worrying about the solder 'running away' on the pad, especially if there is an adjacent via. I think the test will only be applicable on metallic and maybe just HASL finishes. Bruce Houghton Staff Engineer, Celestica, Inc. Internet: [log in to unmask] *** Forwarding note from SMTP2 --IINUS1 08/15/95 17:46 ***