I don't know of anyone to send that out to, but I've done it. Use a diamond burr. Once you get through the die, it gets much easier cutting, so switch to carbide. Don't try to take it to the original PCB board pads--leave a bit of the underfill on there. But the mess! I've used water soluble wax for that kind of thing--coat the rest of the board with the water soluble wax before starting. Good luck! Wayne Thayer On Fri, Feb 25, 2022 at 2:07 PM Peter Wong <[log in to unmask]> wrote: > Does anyone know of a company that can remove a non-reworkable underfilled > BGA? > > I see that Air-Vac sells a high precision milling machine that can claims > to be able to do this. > > We have 20 boards with a 0.79 mm x 0.79 mm BGA that needs to be removed. > The closest component to this BGA is about 0.4 mm away. > > Thanks > Peter > ________________________________ > The enclosed documents are proprietary items to Silicon Forest > Electronics' (SFE) customers. They shall not be reproduced nor disclosed > for any purpose except as specified in writing from an authorized agent of > SFE. These documents may contain data restricted for export by the > International Traffic in Arms Regulations (ITAR) section of the Arms Export > Control Act (or the Export Administration Act). Violators are subject to > severe criminal penalties. > This e-mail, and any file attached to it, is meant only for the intended > recipient of the transmission and may be a communication privileged by law. > If you have received it in error, please notify the sender immediately and > delete the original from your system. Any other use of this e-mail by you > is strictly forbidden. >