I don't know of anyone to send that out to, but I've done it.

Use a diamond burr. Once you get through the die, it gets much easier
cutting, so switch to carbide. Don't try to take it to the original PCB
board pads--leave a bit of the underfill on there.

But the mess! I've used water soluble wax for that kind of thing--coat the
rest of the board with the water soluble wax before starting.

Good luck!

Wayne Thayer

On Fri, Feb 25, 2022 at 2:07 PM Peter Wong <[log in to unmask]> wrote:

> Does anyone know of a company that can remove a non-reworkable underfilled
> BGA?
>
> I see that Air-Vac sells a high precision milling machine that can claims
> to be able to do this.
>
> We have 20 boards with a 0.79 mm x 0.79 mm BGA that needs to be removed.
> The closest component to this BGA is about 0.4 mm away.
>
> Thanks
> Peter
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