https://www.researchgate.net/publication/ 252010687_Effects_of_multiple_rework_on_the_reliability_of_lead- free_Ball_Grid_Array_assemblies On Sep 23, 2021, at 11:57 AM, Guy Ramsey wrote: > We are seeing visual evidence that parts opposite and adjacent to > reworked > BGA are going into reflow. The results are, sometimes, > intermittent function. Debug identifies problems with the nearby > parts. > Is there a discussion of this in an IPC HDBK or standard? > White papers? Text?