https://www.researchgate.net/publication/ 
252010687_Effects_of_multiple_rework_on_the_reliability_of_lead- 
free_Ball_Grid_Array_assemblies

On Sep 23, 2021, at 11:57 AM, Guy Ramsey wrote:

> We are seeing visual evidence that parts opposite and adjacent to  
> reworked
> BGA are going into reflow. The results are, sometimes,
> intermittent function. Debug identifies problems with the nearby  
> parts.
> Is there a discussion of this in an IPC HDBK or standard?
> White papers? Text?