There is a call out from IPC staff to help finish a revision of IPC *IPC-7092 Design and Assembly Process Implementation for Embedded Components* Our committee needs information on the polymeric conductor or insulator materials that can be screened or dispensed onto layers or into rigid circuit boards. Historically, I called this polymer thick film technology - it must take soldering temperatures of rigid boards. We find that "printed electronics" uses conductors or dielectrics that do not reach traditional solder temperatures during component assembly and are not what we are looking for. The exact needs statement is "Add/edit this section to update conductor and heat sinking materials in use with embedded passives." Let me know if you have knowledge so we can contact you. -- Denny Fritz Consultant 812 584 2687