We are considering a change to a manufacturing process which will save time and money, but will cause extra stress on the completed board assembly. Q1) I'm familiar with bow and twist for bare boards, but is there data on flexing a completed assembly? I'm sure it depends on board thickness and material, etc. but is there danger to the board itself? or does it always break a component first? Q2) I'm NOT familiar with stress on components. How can I determine whether we are in danger of damaging components, especially SMDs?