ENEPIG

On Wed, Sep 5, 2018 at 1:17 PM Stadem, Richard D <[log in to unmask]>
wrote:

> What is the finish plating?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
> Sent: Wednesday, September 05, 2018 11:59 AM
> To: [log in to unmask]
> Subject: [TN] Ni intermetallic thickness target
>
> Recently, I was reviewing a lab report. It concluded that the manufacturer
> should increase the IMC thickness as a part of process changes . . .
> It stated that, while there are no industry specifications for IMC
> thickness it s generally accepted that for Pb-free assemblies the IMC
> thickness should be in the 20 to 120 uin range. It seems to be critical of
> a process that produces IMC between 10 and 70 uin on pads across a single
> device.
> Does anybody have reference papers or texts that would support this target
> and process critique?
>