ENEPIG On Wed, Sep 5, 2018 at 1:17 PM Stadem, Richard D <[log in to unmask]> wrote: > What is the finish plating? > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey > Sent: Wednesday, September 05, 2018 11:59 AM > To: [log in to unmask] > Subject: [TN] Ni intermetallic thickness target > > Recently, I was reviewing a lab report. It concluded that the manufacturer > should increase the IMC thickness as a part of process changes . . . > It stated that, while there are no industry specifications for IMC > thickness it s generally accepted that for Pb-free assemblies the IMC > thickness should be in the 20 to 120 uin range. It seems to be critical of > a process that produces IMC between 10 and 70 uin on pads across a single > device. > Does anybody have reference papers or texts that would support this target > and process critique? >