For an easy way to gold wash parts, Durostone (if you have it) or raw FR4 cut to size with holes for the leads/parts to be tinned works very well and efficiently, especially if you have a larger volume.  This can then be ran through a wave solder (dynamic tinning).  I have tinned probably a million parts using variations of this method.

For Dave (Hillman): Can you provide a link for the June presentation?  I would like to read this and/or have for future referencing.

For Richard (Stadem): What the old folks used to say when I grew up (regarding knowing the correct answer but misstating it) is: My tongue got wrapped around my eye teeth and I couldn't see what I was saying.
To wit: The PCB finish, if it is flash gold thickness or less does not typically require gold wash.  However for components (as you rightly corrected), the standards of all SMT and any THT with Gold greater than 100 microinches must be washed (I feel that this may merit being revised to even less in the future such as 50 or 60 microinches).  For NASA (Space Addendum) THT is treated the same as SMT.