thanks On 10 June 2018 at 00:05, Yuan-chia Joyce Koo <[log in to unmask]> wrote: > one more thing, if it is RF device, you might have to worry more: you > can't use silicon data - most likely it is GaAs... you also need to worry > about heat dissipation effect if you underfill... > just a thought.. FYI only. > jk > On Jun 9, 2018, at 11:11 AM, haviv gendelis wrote: > > Are there any rules for types of component to be under filled, for high >> reliability application? >> >> Sent from my iPad >> > -- Haviv Gendelis Technologies Adress: 29 Tzahal st. Yahud Israel Mobile: (972)544390347 Fax: (972)35365715 E-mail: [log in to unmask]