thanks

On 10 June 2018 at 00:05, Yuan-chia Joyce Koo <[log in to unmask]> wrote:

> one more thing, if it is RF device, you might have to worry more: you
> can't use silicon data - most likely it is GaAs... you also need to worry
> about heat dissipation effect if you underfill...
> just a thought.. FYI only.
> jk
> On Jun 9, 2018, at 11:11 AM, haviv gendelis wrote:
>
> Are there any rules for types of component to be under filled, for high
>> reliability application?
>>
>> Sent from my iPad
>>
>


-- 
Haviv Gendelis Technologies

Adress: 29 Tzahal st. Yahud Israel
Mobile: (972)544390347
Fax:      (972)35365715
E-mail: [log in to unmask]