On 7 Mar 2018 at 4:14, Yow GawChern wrote: > Hi, > > I would like to ask, for current technology, is surface mount chip > size 0402 (1005) suitable for solder wave process? I would guess, it depends. If you have the glue process perfectly under control and the placement is OK, why not? Maybe you will need to try it first with a dummy board and to optimize the layout and the settings of your wave inluding scrapping 100 prototype boards. Philips (good old times, when research - Klein-Wassink! -, P&P/soldering equipment, passive components and active components were together) they had wave soldering recommendations for 0.5mm pitch QFPs and I know many designs (mostly high volume consumer stuff) where it worked fine. Maybe you find at Vishay (last not least former Philips Components passsives business) recommendations which look reliable. Regards Matthias -- Unsere Korrespondenz kann mitgelesen werden. Wollen Sie das erschweren, mailen wir uns gerne mit (Open)PGP verschlüsselt. - Matthias Mansfeld Elektronik * Leiterplattenlayout Neithardtstr. 3, 85540 Haar; Tel.: 089/4620 093-7, Fax: -8 Internet: http://www.mansfeld-elektronik.de OpenPGP: http://www.mansfeld-elektronik.de/gnupgkey/mansfeld.asc Fingerprint: 6563 057D E6B8 9105 1CE4 18D0 4056 1F54 8B59 40EF