Outside of the the proper hot air nozzle design and proper keep out regions on the board (like most designers will listen to the repair/rework people?) one can properly shield components using: 1. Thermal shields (we use a ceramic non-woven material) 2. Thermal shield paste (this works phenomenally if the board can be washed-it's made from water and clay. It's consistency is like that of a hair gel) Also, the use of IR heating sources can help by shielding the neighboring components with Al or Cu foil. Bob/BEST Inc On Fri, Mar 30, 2018 at 3:18 PM, Guy Ramsey <[log in to unmask]> wrote: > We are seeing more and more designs where it is not possible, with our BGA > reworkstation, to remove or reinstall components and not reflow adjacent > parts, or in some cases, part on the opposite side of the assembly. > What action do you all take to mitigate the resulting conditions? > -- Bob Wettermann BEST Inc [log in to unmask] Cell: 847-767-5745