Outside of the the proper hot air nozzle design and proper keep out regions
on the board (like most designers will listen to the repair/rework people?)
one can properly shield components using:

1. Thermal shields (we use a ceramic non-woven material)

2. Thermal shield paste (this works phenomenally if the board can be
washed-it's made from water and clay. It's consistency is like that of a
hair gel)

Also, the use of IR heating sources can help by shielding the neighboring
components with Al or Cu foil.

Bob/BEST Inc

On Fri, Mar 30, 2018 at 3:18 PM, Guy Ramsey <[log in to unmask]> wrote:

> We are seeing more and more designs where it is not possible, with our BGA
> reworkstation, to remove or reinstall components and not reflow adjacent
> parts, or in some cases, part on the opposite side of the assembly.
> What action do you all take to mitigate the resulting conditions?
>



-- 
Bob Wettermann
BEST Inc
[log in to unmask]
Cell: 847-767-5745