I mentioned that earlier and it is critical to do so. If you do something that violates what the connector requires, you own the scrap. Thanks and Best Regards, Gerry Gagnon Supplier Quality Manager FLIR Systems, Inc. 9 Townsend W, Nashua, NH 03063 USA<x-apple-data-detectors://1/1> Direct: +1 603 324 7895<tel:+1%20603%20324%207895> | Mobile: +1 781 366 5943<tel:+1%20781%20366%205943> Email: [log in to unmask]<mailto:[log in to unmask]> | www.flir.com<http://www.flir.com/> The World’s Sixth Sense® On Feb 22, 2018, at 1:21 PM, Stadem, Richard D <[log in to unmask]<mailto:[log in to unmask]>> wrote: What does the mating connector drawing recommend? -----Original Message----- From: [log in to unmask]<mailto:[log in to unmask]> [mailto:[log in to unmask]] Sent: Thursday, February 22, 2018 12:04 PM To: [log in to unmask]<mailto:[log in to unmask]>; Stadem, Richard D Cc: [log in to unmask]<mailto:[log in to unmask]> Subject: RE: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer Dell - Internal Use - Confidential The DDR3 DIMM before me are 0.047 inch with a chamfer. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D Sent: Thursday, February 22, 2018 11:56 AM To: [log in to unmask]<mailto:[log in to unmask]> Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer Yup, I agree. -----Original Message----- From: Yuan-chia Joyce Koo [mailto:[log in to unmask]] Sent: Thursday, February 22, 2018 11:41 AM To: TechNet E-Mail Forum; Stadem, Richard D Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer majority of connector damage is due to mismatch thickness (too thick). Normal proper singulation is not a problem for the edge - monitor the dust and damage... you don't want any thing fall into the connector matting area), except some manual cuts or other cheap version of cut-off edge methods NA usually don't see. (problem start observe in mid 90s... on imported PWB... not only edge but stacking thickness too... you find out core thickness variation causes overall stack thickness problem - connector damage)... If my memory serve me right, the qual board were OK within spec.. the subsequent shipment got problem... the vendor collect the order and farm out to other shops... (of course, he lost the contract after batch variation were found with different date code - thanks god the date code was one of the traceable clue)... for your reference only. jk On Feb 22, 2018, at 12:26 PM, Stadem, Richard D wrote: And to add to Steve's posting, I believe it is optional because usually DIMM cards are .031" thick, sometimes even .010", so if the mating connector can handle that, then why bevel? -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory Sent: Thursday, February 22, 2018 10:17 AM To: [log in to unmask]<mailto:[log in to unmask]> Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer Victor, JEDEC is the organization that defines mechanical specifications for DIMM modules, not the IPC. All of the design specifications for the different modules (DDR3, DDR4, DDR5, etc.) show a beveled edge but the notes say that it is optional. All you have to do is take some time and register yourself on the JEDEC page, and you can see every one of the design specifications for free. Steve On Thu, Feb 22, 2018 at 8:38 AM, <[log in to unmask]<mailto:[log in to unmask]>> wrote: Dell - Internal Use - Confidential Fellow TechNetters: Is there an consensus out there whether the gold finger edge on DDR3 DIMM Modules be beveled/Coined/Chamfer. I would appreciate any comments/remarks on this topic. Victor, -----Original Message----- From: Hernandez, Victor G Sent: Wednesday, February 21, 2018 1:10 PM To: TechNet <[log in to unmask]<mailto:[log in to unmask]>> Cc: Hernandez, Victor G <[log in to unmask]<mailto:[log in to unmask]>> Subject: FW: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/ Chamfer Fellow TechNetters: Any additional comments and/or concern over the gold finger edge being Beveled/Coined/Chamfered. Many a times do I see socket with gold plated wire contact gouges from DIMM product that has not been beveled/Coined/Chamfered, even bent pins. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios Sent: Wednesday, February 21, 2018 8:15 AM To: [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]> Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/ Chamfer I don't know of a fully fledged std for it, other than workmanship acceptance criteria in 6012 and possibly mentions of design guidance in 2221 Sent from my iPhone On Feb 21, 2018, at 8:57 AM, "[log in to unmask]<mailto:[log in to unmask]><mailto: [log in to unmask]<mailto:[log in to unmask]>>" <[log in to unmask]<mailto:[log in to unmask]><mailto: [log in to unmask]<mailto:[log in to unmask]>>> wrote: Fellow TechNetters: Does IPC still have a STD for the above stated processt? If so, can someone direct me to the document. Victor, -- Steve Gregory Kimco Design and Manufacturing Process Engineer (208) 322-0500 Ext. -3133 -- This email and any attachments are only for use by the intended recipient(s) and may contain legally privileged, confidential, proprietary or otherwise private information. Any unauthorized use, reproduction, dissemination, distribution or other disclosure of the contents of this e-mail or its attachments is strictly prohibited. If you have received this email in error, please notify the sender immediately and delete the original.