Yeah, if wishes were horses... -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Tuesday, September 5, 2017 10:55 AM To: [log in to unmask] Subject: Re: [TN] Multilayer PCB of Different Substrat Thickness RF Design Even one month, and the following month both the designer and the fabricator should work in the production side. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Yuan-chia Joyce Koo Sent: Tuesday, September 05, 2017 12:45 PM To: [log in to unmask] Subject: Re: [TN] Multilayer PCB of Different Substrat Thickness RF Design i always believe to send designer to fab house for 6 month (even 3 month) will do a world of good... On Sep 5, 2017, at 1:32 PM, Dwight Mattix wrote: > Fun times that. Unbalanced in material thickness + single sided > sequential lam to get the last core into the stack. Hope you have an > experienced fabricator who is willing to plan some extra time > into the process for long press cool down and a flatbake after. > Don't rush that. > > Also, hope you're prefilling the blind via in the 62 mil core with a > non-conductive epoxy (e.g. San-Ei PHP). Doubt 4450 is going to have > volume of free resin needed for that. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory > Sent: Tuesday, September 5, 2017 10:21 AM > To: [log in to unmask] > Subject: Re: [TN] Multilayer PCB of Different Substrat Thickness RF > Design > > Hi Ricardo, > > I finally have your picture posted, Richard was right, had some > pressing things on the production floor to take care of after the long > weekend. > Here's your stack-up drawing: > > http://stevezeva.homestead.com/Ricardo_Stackup.jpg > > Steve > > On Tue, Sep 5, 2017 at 7:50 AM, Stadem, Richard D. > <[log in to unmask] >> wrote: > >> Hi, Ricardo >> >> I do not have the capability to post your picture, but I am sure >> Steve can, and I see you have copied him. >> >> Being that many people are taking vacations here this week as part of >> Labor Day weekend, not sure when Steve will be in. You may need to >> wait until later today. >> >> In looking at the stack-up, I do not have a lot of expertise in this >> area, but I do know that having differing layer thickness can maybe >> cause some issues with different coefficients of thermal expansion >> during reflow and other heat excursions. This can put stresses on the >> vias passing all the way through the board. But I am not an expert in >> those issues. One suggestion; you would be wise to also pose the >> question to the Designers Forum. I am sure they can give you plenty >> of advice on that. >> >> Richard >> >> >> >> *From:* Ricardo Moncaglieri [mailto:[log in to unmask]] >> *Sent:* Tuesday, September 05, 2017 8:34 AM >> *To:* Stadem, Richard D.; Steve Gregory >> *Subject:* Re: Multilayer PCB of Different Substrat Thickness RF >> Design >> >> >> >> Steve, Richard, >> >> Would you pls upload the herebelow quoted image inord to be more >> clear on my quetion to the forum? >> >> Indeed hope to receive your comments / advise. >> >> Keep awaiting. >> >> Thank you very much, brgds,Ricardo >> >> >> >> ------------------------------------------------------------ >> ------------------------------------------------------------ >> --------------------------------------------------------------------- >> >> Estimated colleagues, >> >> Nice to get in contact again with all of you after a bit long time. >> >> We are deploying a RF design and by first time we intend to use a >> multilayer pcb with different substrat thickness as shows the >> stack-up herebelow detailed. >> >> Questions here are: >> >> As per your experience, is it recomendable such a kind of substrat >> design? >> >> Some pcb provider reported it is very difficult to achieve. Can you >> recommend or share your background about pcb provider who can assure >> high reliability on this pcb provision? >> >> Keep awaiting for your unvaluable feedback. >> >> brgds, Ricardo >> >> Ricardo Moncaglieri >> >> QA Electronic Service Manager >> >> INVAP SE >> >> www.invap.com.ar >> >> > > > -- > Steve Gregory > Kimco Design and Manufacturing > Process Engineer > (208) 322-0500 Ext. -3133 > > -- > > > This email and any attachments are only for use by the intended > recipient(s) and may contain legally privileged, confidential, > proprietary or otherwise private information. Any unauthorized use, > reproduction, dissemination, distribution or other disclosure of the > contents of this e-mail or its attachments is strictly prohibited. If > you have received this email in error, please notify the sender > immediately and delete the original.