Fellow TechNetters: Perhaps the third time is the charm: Is there any data out there regarding the integrity of a Thermal Header Solder Attachment/Bottom Termination Component solder joint integrity over time. Most BTC that I have x-rayed exhibit some degree of voiding. Can the solder joint voiding degrade the solder connection to a point that it would result in a shorted device internally due to heat build. Is a solder joint a considered a Thermal Insulator? Victor, From: Hernandez, Victor G Sent: Monday, January 16, 2017 3:15 PM To: TechNet E-Mail Forum <[log in to unmask]> Cc: Hernandez, Victor G <[log in to unmask]> Subject: FW: IPC Standard, Thermal Header Solder Attachment Devices, or Bottom Termination Components Fellow TechNetters: My original post last week did not generate any feedback. Therefore, I post again in hope of reaching more audience the beginning of the week. The holidays are over with and the serious work begins. Victor, From: Hernandez, Victor G Sent: Thursday, January 12, 2017 7:46 AM To: 'TechNet E-Mail Forum' <[log in to unmask]<mailto:[log in to unmask]>> Cc: Hernandez, Victor G <[log in to unmask]<mailto:[log in to unmask]>> Subject: IPC Standard, Thermal Header Attachment Devices, THAD Fellow TechNetters: Is there any data out there regarding the integrity of a Thermal Header Solder Attachment/Bottom Termination Component solder joint integrity over time. Most BTC that I have x-rayed exhibit some degree of voiding. Can the solder joint voiding degrade the solder connector to a point that it would result in a shorted device internally. Is a solder joint a Thermal Insulator? Victor,