http://ieeexplore.ieee.org/document/1645469/ > Hi Mike - the general consensus is that there is an issue with the nickel > plating layer. Not a ton of data in the published literature but a topic > that has been discussed a length in the IPC-JSTD-002/003 committees at > times. > > Dave Hillman > Rockwell Collins > > On Thu, Dec 15, 2016 at 7:53 PM, Lehmicke, Michael < > [log in to unmask]> wrote: > >> What is the root cause of Black Oxide issues in ENIG plating? >> >> Mike Lehmicke >> Project Engineer >> DSS Division >> Molex, LLC-Printed Circuit Solutions >> 22 Empire Drive >> St. Paul, MN 55103 >> 651-846-7728 >> [log in to unmask]<mailto:[log in to unmask]> >> >> [cid:[log in to unmask]][cid:[log in to unmask]]< >> http://www.molex.com/> >> >> >> ________________________________ >> >> >> >> CONFIDENTIALITY NOTICE: This message (including any attachments) may >> contain Molex confidential information, protected by law. If this >> message >> is confidential, forwarding it to individuals, other than those with a >> need >> to know, without the permission of the sender, is prohibited. >> >> This message is also intended for a specific individual. If you are not >> the intended recipient, you should delete this message and are hereby >> notified that any disclosure, copying, or distribution of this message >> or >> taking of any action based upon it, is strictly prohibited. >> >> English | Chinese | Japanese >> www.molex.com/confidentiality.html >> >