Juliano, Can you share some pics of your observation. A picture is worth one thousand words. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Datacom - Juliano Ribeiro Sent: Friday, November 11, 2016 5:21 AM To: [log in to unmask] Subject: [TN] RES: [TN] Immersion Tin - problems Damaged = "Pad disappeared" the track has broken _____________________________ Juliano Bettim Ribeiro DATACOM +55 (51) 8446-2135 +55 (51) 3933-3000 Ramal: 3484 -----Mensagem original----- De: TechNet [mailto:[log in to unmask]] Em nome de George Wenger Enviada em: quinta-feira, 10 de novembro de 2016 17:32 Para: [log in to unmask] Assunto: Re: [TN] Immersion Tin - problems What do you mean by "damaged"? Do you mean solder doesn't wet the pad or is there physical damage? Sent from my iPhone > On Nov 10, 2016, at 1:16 PM, Vladimir <[log in to unmask]> wrote: > > Hi Juliano, > > The board finish most probably has nothing to do with the problem. It must be your process. > > Regards, > > Vladimir > SENTEC > > Sent from my BlackBerry 10 smartphone on the Rogers network. > Original Message > From: Datacom - Juliano Ribeiro > Sent: Thursday, November 10, 2016 13:13 > To: [log in to unmask] > Reply To: TechNet E-Mail Forum > Subject: [TN] Immersion Tin - problems > > Hello to all, > > > > We recently are changing to Lead Free process to specific products and > we need to change the finishes boards from (HAL Tin Lead) to Immersion Tin. > > But during the Selective Soldering process the component pad is damaged. > > Are there limitation about Immersion Tin about Max. Temperature, Max. > Reflow/Wave process, Max Soldering Contact Time, etc.??? > > In this case the HAL Lead Free is better? > > > > > > Thank you > > Juliano Ribeiro