What do you mean by "damaged"?  Do you mean solder doesn't wet the pad or is there physical damage?

Sent from my iPhone

> On Nov 10, 2016, at 1:16 PM, Vladimir <[log in to unmask]> wrote:
> 
> Hi Juliano,
> 
> The board finish most probably has nothing to do with the problem. It must be your process.
> 
> Regards,
> 
> Vladimir
> SENTEC
> 
> Sent from my BlackBerry 10 smartphone on the Rogers network.
>   Original Message  
> From: Datacom - Juliano Ribeiro
> Sent: Thursday, November 10, 2016 13:13
> To: [log in to unmask]
> Reply To: TechNet E-Mail Forum
> Subject: [TN] Immersion Tin - problems
> 
> Hello to all,
> 
> 
> 
> We recently are changing to Lead Free process to specific products and we
> need to change the finishes boards from (HAL Tin Lead) to Immersion Tin.
> 
> But during the Selective Soldering process the component pad is damaged. 
> 
> Are there limitation about Immersion Tin about Max. Temperature, Max.
> Reflow/Wave process, Max Soldering Contact Time, etc.???
> 
> In this case the HAL Lead Free is better?
> 
> 
> 
> 
> 
> Thank you
> 
> Juliano Ribeiro