Hi Ed, I don't think the string has anything to do with the problem they see. Regards, Vladimir SENTEC Sent from my BlackBerry 10 smartphone on the Rogers network. Original Message From: Ed Popielarski Sent: Thursday, November 10, 2016 13:59 To: [log in to unmask] Reply To: TechNet E-Mail Forum Subject: Re: [TN] Immersion Tin - problems http://www.circuitnet.com/experts/87578.html Ed Popielarski Engineering Manager 970 NE 21st Ct. Oak Harbor, Wa. 98277 Ph: 360-675-1322 Fx: 206-624-0695 Cl: 360-544-2289 "It's one kind of victory to slay a beast, move a mountain, and cross a chasm, but it's another kind altogether to realize that the beast, the mountain, and the chasm were of your own design." https://goo.gl/maps/mMjg43rXeFB2 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Datacom - Juliano Ribeiro Sent: Thursday, November 10, 2016 10:12 AM To: [log in to unmask] Subject: [TN] Immersion Tin - problems Hello to all, We recently are changing to Lead Free process to specific products and we need to change the finishes boards from (HAL Tin Lead) to Immersion Tin. But during the Selective Soldering process the component pad is damaged. Are there limitation about Immersion Tin about Max. Temperature, Max. Reflow/Wave process, Max Soldering Contact Time, etc.??? In this case the HAL Lead Free is better? Thank you Juliano Ribeiro