Correct. I do not know of any hi-rel programs that allow anything less in the contract. Occasionally there are un-inspectable portions of a design, but even those require qualification by implication and a frozen, locked-down process. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Carroll, Thomas A Sent: Tuesday, September 20, 2016 11:25 AM To: [log in to unmask] Subject: Re: [TN] J-STD-001 Space Addendum You are dealing with space hardware, 100% inspection is required. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios Sent: Tuesday, September 20, 2016 12:14 PM To: [log in to unmask] Subject: Re: [TN] J-STD-001 Space Addendum What I meant is that when placing replicate devices from the same lot across a pwb during assembly, the cleaning, the paste screening process, reflow process, etc is common to that pwb, hence lending itself to sampling. > On Sep 20, 2016, at 11:45 AM, Mattix, Dwight <[log in to unmask]> wrote: > > Re: "...the processing of the board is the same for the entire PWA??" > > Is that the only factor to ponder? > It would seem to be a first order effect to be sure. > > What about other inputs? E.g. > Variability in surface factors affecting wetting: > - solderable finish variance from pwb to pwb? > - Variability in surface cleanliness from pwb to pwb, different lots of pwbs > - variability in component lead's finish and wettability, different component lots > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. > Sent: Tuesday, September 20, 2016 6:20 AM > To: [log in to unmask] > Subject: Re: [TN] J-STD-001 Space Addendum > > Agreed. The cost is neglible. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke > Sent: Monday, September 19, 2016 7:00 PM > To: [log in to unmask] > Subject: Re: [TN] J-STD-001 Space Addendum > > Xray every one of them. > > Best regards, > > John Burke > > >> On Sep 19, 2016, at 2:52 PM, Joey Rios <[log in to unmask]> wrote: >> >> Sections 7.5.14, 15 and 16 outlines inspection of hidden solder joints, invoking the use of X-Ray in the Space Addendum. The standard does not explicitly prescribe a sampling extent, so, if an assembly has dozens of the same device, like 50-100 say of such devices (such as a bottom termination component) on a single PWA, is the expectation (J-STD intent) that each of the replicate devices are inspected by X-Ray?? Is that what the industry practices, or is sampling commonly invoked, since the processing of the board is the same for the entire PWA??