Hi John - I have seen very successful laser de-paneling but there was a limitation on board thickness. The boards needed to be more on the thin side (0.030") than the thick side (0.100"). Plus the type of laminate played a big role in success or failure of the process. Dave Hillman Rockwell Collins [log in to unmask] On Mon, Sep 19, 2016 at 1:36 PM, John Burke <[log in to unmask]> wrote: > Hi guys, > > Discussion came up on removal of routing dust particularly under BGA's > what is best practice? > > Also does anyone have experience of laser de-paneling ?? > > Best regards, > > John Burke >