Hi John - I have seen very successful laser de-paneling but there was a
limitation on board thickness. The boards needed to be more on the thin
side (0.030") than the thick side (0.100"). Plus the type of laminate
played a big role in success or failure of the process.

Dave Hillman
Rockwell Collins
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On Mon, Sep 19, 2016 at 1:36 PM, John Burke <[log in to unmask]> wrote:

> Hi guys,
>
> Discussion came up on removal of routing dust particularly under BGA's
> what is best practice?
>
> Also does anyone have experience of laser de-paneling ??
>
> Best regards,
>
> John Burke
>