residual stress. design and MFG issues. you should have co- planarity in dwg and spell out user condition before and after reflow simulation as part requirement. and go through qualification process before hit production... a vendor selection problem. On Jul 6, 2016, at 2:39 AM, Deng RongJun wrote: > Hello fellow Techies, > > I have got a problem with shielding cans deformation issue. There > are several kinds of shielding cans on board, we have found one > shielding have deformation after reflow, one side of shielding lift > and not solder on board. > We also do a test, bake the individual shielding in oven with 230 > degree, the shielding still have deformation and two corner have > lift. Take out the shielding from oven and temperature go down, > then shielding go back to good. > Any one of you have experience on this case? > > Pictures: > https://goo.gl/photos/xQLbFT1AEwTR2iV68 > > Thank you very much. > > Best regards > Deng