My instinct is to say yes. It is a concern. You should be able to rinse the lead from the pads by double tinning with the Sn95 solder. If this is a critical application you should confirm that the rinse works. ESD or XRF would be useful. On Tue, Jul 12, 2016 at 8:27 AM, Mary Grace Keenan < [log in to unmask]> wrote: > I have a question regarding using the high temp solder after removing > standard solder Sn63/Pb37. After wicking away the standard solder, we need > to re-solder the wiring and components using the high temp solder > (Sn95/Ag5). We are concerned that the integrity of the solder joint and > the temperature rating may be negatively affected. Is this a legitimate > concern? Any suggestions? >