"mud crack"? http://iweb.tms.org/PbF/JOM-0606-75.pdf On Jun 27, 2016, at 10:03 AM, Mumtaz Bora wrote: > Dear TechNetters, > > We were observing some solderability issues in laminate based QFNs. > The solderable terminations were plated with ENIG( Electroless > Nickel, Immersion Gold). SEM/EDX analysis showed Nickel plating > cracks on the terminations. I have requested Steve Gregory to post > the image on his website. If the experts can shed some light on the > failure mechanism, I will appreciate it. > > Thank-you, > Mumtaz > 858-795-0112 > > CONFIDENTIALITY NOTE: The information transmitted, including > attachments, is intended only for the person(s) or entity to which > it is addressed and may contain confidential and/or privileged > material. Any review, retransmission, dissemination or other use > of, or taking of any action in reliance upon this information by > persons or entities other than the intended recipient is > prohibited. If you received this in error, please contact the > sender and destroy any copies of this information. > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud > service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________