On 5/4/2016 9:14 AM, Stadem, Richard D. wrote: > In looking at the test methods for a proprietary semi-solder paste/solder ink, I wanted to test slumping. The material I am qualifying is actually a blend. I have the small staggered stencil, but J-STD-005 says: > > > 3.7 Solder Ball Test; the solder paste when tested in accordance with 3.7.1 shall meet the requirements specified. > > 3.7.1 Type 1-6 Powder; the solder paste with Type 1 through 4 type powders defined in IPC-TM-650, Test Method 2.4.43, shall meet the acceptance criteria presented in Figure 3-3. > > 3.7.2 Type 7 Powder; the solder paste with type 7 powders does not require testing and should be determined AABUS. > > So how do I test a Type 5 or 6? Is Method 2.4.43 applicable? > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ yes, the test is applicable to types 1, 2, 3, 4, 5 and 6. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________