kovar lead? what is size of the device? On Apr 18, 2016, at 6:05 PM, Ricardo Moncaglieri wrote: > Jim, > Temp cycle range is +50°C to +125°C. > I dont have yet the temp ramp rate. > brgds,Ricardo > >>>> "Maguire, James F" <[log in to unmask]> 18/04/2016 19:02 >>>> > What is temp cycle condition again? You have 50 to 125C but did you > mean -50C to +125C? Also are you doing temp cycle or air/air temp > shock > (ie. what is ramp rate in chamber or better yet as measured on the > product during temp cycle). > > > Jim Maguire > Intel Corporation > ATD Q&R Stress Lab Operations > Hawthorne Farms; Oregon > Engineer > Phone: 503-696-3309 > Cell: 253-651-9373 > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo > Moncaglieri > Sent: Monday, April 18, 2016 2:58 PM > To: [log in to unmask] > Subject: Re: [TN] Solder Cracking After Thermal Cicling > > Steve, > Responding your question. > > Soldered connection is not put under vibration during temp cicling. > > This terminal belongs to a connector which is screwed on a case and > its > terminal passes through this metalic case and lyies on the pcb ENEPIG > pad. > So that there are following CTEs playing and intercating each other > all > together: > > PCB CTE > Solder CTE > Case CTE where is screwed the conector > Terminal CTE > > brgds,Ricardo > >>>> Steve Gregory <[log in to unmask]> 18/04/2016 18:47 >>> > Hi Ricardo, > > I finally have your pictures up, they are here: > > http://stevezeva.homestead.com/ > A15_Photos_of_pre__post_100_temp_cycling_CSC-10_SN12.pdf > > Boy, that looks like a big CTE mis-match. A question; are the boards > going through ESS? Vibration along with the temp cycling? > > Steve > > On Mon, Apr 18, 2016 at 2:35 PM, Ricardo Moncaglieri < > [log in to unmask]> wrote: > >> Steve, >> Attached arethe pictures. >> Thank you a lot. >> Await for your comments. >> brgds,Ricardo >> >>>>> Steve Gregory <[log in to unmask]> 18/04/2016 15:22 >>> >> Hi Ricardo, >> >> The Technet server strips the attachments, send your photo directly > to me >> and I'll get it posted... >> >> Steve >> >> On Mon, Apr 18, 2016 at 11:43 AM, Ricardo Moncaglieri < >> [log in to unmask]> wrote: >> >>> Dear colleagues; >>> >>> Steve Gregory, could you please upload the enclosed picture? >>> >>> Solder become perturbated / cracked after thermal cicling: >>> >>> This picture corresponds to a plane (not circular) conector > terminal >>> solded to a pcb pad ENEPIG finished. >>> The connector terminal has been gold removed by twice pretin. >>> Solder used is Sn63Pb37. >>> Thermal cicling: 50°C to 125°C >>> >>> As picture showed there are stretch marks toward left direction > and >>> showed solder crack. >>> >>> Our provider reported temperature didnt pass over 125°C and solder > used >>> 63/37. >>> >>> Question: >>> >>> How could these kind of gooves or stretch marks have been produced > >>> taking into account they are just toward one direction (left) and > of >>> considerable length? >>> Just mecanic stress? >>> Temperature overpassing on any cicle? >>> Need of use of different alloy, ie.: In, Bi etc? >>> Provider reported the process is being useed from them since long > ago >>> (same solder alloy, temperature, pcb, terminal conector, thermal >>> cicling) but this is the first time they faced with such a > cracking. >>> >>> Do you have any comment in order to anlyse/solve this trouble. >>> >>> Appreciate your feedback we are in middle of a providing > acceptance >>> tests space quality level (IPC class 3). >>> >>> brgds,Ricardo >>> >>> >>> >>> > ______________________________________________________________________ >>> This email has been scanned by the Symantec Email Security.cloud > service. >>> For more information please contact helpdesk at x2960 or >> [log in to unmask] >>> > ______________________________________________________________________ >>> >> >> -- >> >> >> This email and any attachments are only for use by the intended >> recipient(s) and may contain legally privileged, confidential, > proprietary >> or otherwise private information. 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