Hi Gil - the Au layer doesn't concern me provided the nickel barrier layer is fabricated/plated correctly. You would be soldering to the nickel layer and not the gold layer.The nickel layer should not diffuse away in a controlled soldering process. Dave Hillman Rockwell Collins [log in to unmask] On Tue, Apr 5, 2016 at 9:01 AM, Zilber Gil <[log in to unmask]> wrote: > Hi Dave, > > Thank you the response, > > Layer 1 is probably, the Pd/Au fired metallization, but the 4 micron pure > Au is in addition to that. Is it an issue? > > > > Thanks, > > > > Gil > > > > *From:* David Hillman [mailto:[log in to unmask]] > *Sent:* Tuesday, April 05, 2016 4:22 PM > *To:* TechNet E-Mail Forum; Zilber Gil > *Subject:* Re: [TN] Pad construction > > > > Hi Gil - I am making the assumption that the Pd/Au is a fired > metallization layer that is part of the component ceramic body fabrication > process. The nickel is a soldering diffusion barrier to prevent the Pd/Au > from being leached off and you have SnPb layer for solderability. Pretty > standard type of plating stackup for a ceramic bodied component (i.e. > precious metal layer/diffusion barrier/solderable layer). I don't see this > plating stackup as causing you any issues. As always, ceramic body > components can often have CTE mismatch issues which impacts the solder > joint integrity but that is not an issue related to the plating stackup. > > > > Dave > > > > On Tue, Apr 5, 2016 at 2:29 AM, Zilber Gil <[log in to unmask]> wrote: > > Hi All, > I have an attenuator (ceramic body) with the following pad layers: > 1. Pd - adhesion layer > 2. Au- 4 micrometer > 3. Ni - 1.8 micrometer > 4. SnPb > > This is the first time I am seeing such a pad construction. Does anyone > have an idea if I should expect any reliability issue (aerospace > application)? > > > Thanks, > > > Dr. Gil Zilber > Elta Systmes Ltd. > > > > The information contained in this communication is proprietary to Israel > Aerospace Industries Ltd. and/or third parties, may contain confidential or > privileged information, and is intended only for the use of the intended > addressee thereof. If you are not the intended addressee, please be aware > that any use, disclosure, distribution and/or copying of this communication > is strictly prohibited. If you receive this communication in error, please > notify the sender immediately and delete it from your computer. > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > > > > > This Email and the attachments were emulated by Check Point > ThreatEmulation Service. > > The information contained in this communication is proprietary to Israel > Aerospace Industries Ltd. and/or third parties, may contain confidential or > privileged information, and is intended only for the use of the intended > addressee thereof. If you are not the intended addressee, please be aware > that any use, disclosure, distribution and/or copying of this communication > is strictly prohibited. If you receive this communication in error, please > notify the sender immediately and delete it from your computer. > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________