Many thanks for the good insight Ramon. Rich Kraszewski (920) 969-6075 From: Ramon Essers | ETECH-trainingen [mailto:[log in to unmask]] Sent: Friday, February 26, 2016 3:02 PM To: TechNet E-Mail Forum; Richard Kraszewski Subject: Re: [TN] IPC Standard For Max Temp on Through Hole Components The max Temp also depends on time and the Tg and Td of your PCB and of the type of flux you are using. Another thing you can ask yourself, Is the temp on the soldering station also the same temp on my tip? Or are you using another soldering technique like selective wave, intrusive soldering, etc.? Witch type of coating finish are you using? Do you preheat the PCB? The best thing you can do is to get in touch with an official IPC training center. An IPC training center is not only there for IPC certification but they can also help you with this sort of questions. Of course you can also sent me a private mail. Please note that the component and procedure you are using also have a level of conformance. Met vriendelijke groet, Kind regards, Mit freundlichen Grüβen, Ramon Essers managing Director, ETECH - trainingen supporting the electronics industry Office & training center: Noord Brabantlaan 265, NL-5652 LD Eindhoven, the Netherlands Back office: PO box 1005, NL-6460 BA Kerkrade, the Netherlands Phone: +31 (0)45 - 7 11 23 90 Mobile: +31 (0)6 - 54230905 Email: [log in to unmask]<mailto:[log in to unmask]> http://www.etech-trainingen.nl<http://www.etech-trainingen.nl/> http://www.etech.training http://www.ipctraining.eu<http://www.ipctraining.eu/> Skype: etech-trainingen Kamer van Koophandel/CoC: 14129416 BTW-nummer/VAT: NL157223255.B01 P Please consider the environment before printing this e-mail. DISCLAIMER: Aan dit bericht, waaronder ook de eventuele bijlagen worden bedoeld, kunnen geen rechten worden ontleend. Dit bericht is uitsluitend bestemd voor de geadresseerde en bevat persoonlijke en vertrouwelijke informatie. Het bekend maken, kopiëren en verspreiden van een bericht dat niet voor u bestemd is, is niet toegestaan. Als u dit bericht per ongeluk heeft ontvangen, verzoeken wij u vriendelijk het direct te vernietigen en de afzender te informeren. Twijfelt u onder de juistheid of volledigheid van dit bericht? Neem dan contact op met de afzender. This message and any associated attachments cannot be deemed as legally binding under any circumstances. This message is intended for the exclusive use of the person(s) mentioned as recipient(s) and contains personal and confidential information. Directly or indirectly copying, disclosing, distributing, printing, publicizing and/or in any way using this message or any part thereof by any means is strictly prohibited if you are not the intended recipient(s). If you have received this message in error, please notify the sender and delete this message from your system immediately. If you are in doubt regarding the correctness and/or completeness of this message, please contact the sender. Aufgrund dieser Nachricht beziehungsweise eventueller Anlagen zu dieser Nachricht können keine Rechte geltend gemacht werden. Diese Nachricht richtet sich ausschließlich an die Adressantin beziehungsweise den Adressaten und enthält persönliche sowie vertrauliche Informationen. Es ist strengstens untersagt, eine nicht an Sie gerichtete Nachricht bekannt zu machen, zu kopieren oder zu verbreiten. Sollten Sie diese Nachricht versehentlich erhalten haben, bitten wir Sie, diese umgehend zu vernichten und die Absenderin beziehungsweise den Absender zu informieren. Haben Sie Zweifel in Bezug auf die Richtigkeit oder Vollständigkeit dieser Nachricht? Setzen Sie sich dann mit der/dem Absender in Verbindung. Op 26 feb. 2016, om 20:58 heeft Richard Kraszewski <[log in to unmask]<mailto:[log in to unmask]>> het volgende geschreven: Thanks Dave. Rich Kraszewski (920) 969-6075 From: David Hillman [mailto:[log in to unmask]] Sent: Friday, February 26, 2016 1:49 PM To: TechNet E-Mail Forum; Richard Kraszewski Subject: Re: [TN] IPC Standard For Max Temp on Through Hole Components Hi Rich - I don't know of a standard that addresses your question. Typically, that is a component specific attribute you need to pull from the technical data sheets. There is IPC JSTD 075 which talks to process temperature/component compatibility but its not slanted to any specific component technology. Dave Hillman Rockwell Collins "stuck in the airport but working" On Fri, Feb 26, 2016 at 12:22 PM, Richard Kraszewski <[log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]>> wrote: Does anyone recall which if any standard would address this? Rich Kraszewski /Plexus ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________