Thanks Dave. Rich Kraszewski (920) 969-6075 From: David Hillman [mailto:[log in to unmask]] Sent: Friday, February 26, 2016 1:49 PM To: TechNet E-Mail Forum; Richard Kraszewski Subject: Re: [TN] IPC Standard For Max Temp on Through Hole Components Hi Rich - I don't know of a standard that addresses your question. Typically, that is a component specific attribute you need to pull from the technical data sheets. There is IPC JSTD 075 which talks to process temperature/component compatibility but its not slanted to any specific component technology. Dave Hillman Rockwell Collins "stuck in the airport but working" On Fri, Feb 26, 2016 at 12:22 PM, Richard Kraszewski <[log in to unmask]<mailto:[log in to unmask]>> wrote: Does anyone recall which if any standard would address this? Rich Kraszewski /Plexus ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________