"based on the time history listed in the report, the appearance of the solder joint and the technologies on the board (plated thru hole), I would surmise that the solder alloy is tin/lead and not lead-free. However, there is no technical information listed in the report to confirm that assumption." It is conceivable that this assembly was deliberately designed using thru components due to the high shock / vibe operating environment. Although what appears to be a lack of secondary mechanical means of support on larger components raises some doubt to that thought. The cracked joint/lifted land appears to be bottom side ... could be the result of an improperly inserted component subjected to vibration?