"based on the time history listed in the report, the appearance
of the solder joint and the technologies on the board (plated thru hole), I
would surmise that the solder alloy is tin/lead and not lead-free. However,
there is no technical information listed in the report to confirm that
assumption."

It is conceivable that this assembly was deliberately designed using thru components due to the high shock / vibe operating environment.
Although what appears to be a lack of secondary mechanical means of support on larger components raises some doubt to that thought.

The cracked joint/lifted land appears to be bottom side ... could be the result of an improperly inserted component subjected to vibration?