Victor, In my opinion, if it's not intended as an electrical conductor and only a mechanical locator/retainer, hole fill doesn't apply. Locating pins are for locating, not grounding, otherwise they would be called grounding pins. I recall a study wherein the pullout force required to extract a "post" from the component side was virtually the same whether the hole was filled or just bottom wetted. Ed Popielarski Engineering Manager 970 NE 21st Ct. Oak Harbor, Wa. 98277 Ph: 360-675-1322 Fx: 206-624-0695 Cl: 949-581-6601 "It's one kind of victory to slay a beast, move a mountain, and cross a chasm, but it's another kind altogether to realize that the beast, the mountain, and the chasm were of your own design." https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&spn=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez Sent: Wednesday, November 04, 2015 8:16 AM To: [log in to unmask] Subject: [TN] IPC Standards, lead vertical solder fill Fellow TechNetters: Is there an IPC guideline/specification for vertical solder fill for mechanical leads, non-functional, for connectors, Heat Sinks, mechanical hold down strap of passive/active components, etc.. Can the 50 - 75% criteria be used on these solder connections? The same goes for lead protrusion of the leads. Victor, ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________