I doubt there would be anything in the JEDEC standards, but I could be wrong. Too many variations of a theme to cover them all. But I would be sure to expect something on the part drawing. -----Original Message----- From: Yuan-chia Joyce Koo [mailto:[log in to unmask]] Sent: Monday, November 09, 2015 7:16 PM To: TechNet E-Mail Forum; Stadem, Richard D. Subject: Re: [TN] IPC SMT Lead to package co-planarity check jedec standard for components dwg package. plus your stencil paste height after reflow. On Nov 9, 2015, at 2:09 PM, Stadem, Richard D. wrote: > That would be in the component drawing from the vendor. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez > Sent: Monday, November 09, 2015 12:51 PM > To: [log in to unmask] > Subject: [TN] IPC SMT Lead to package co-planarity > > Fellow TechNetters: > > In which IPC STD will I find information of distance between the > plastic housing standoff and lead height. INMHO the standoff > should rest on the solder mask surface while the lead should have a > slight gap to rest on the PWB copper pads. I hope that this makes > sense. A print/spec is not readily available. > > Victor, > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud > service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ______________________________________________________________________ > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud > service. > For more information please contact helpdesk at x2960 or > [log in to unmask] > ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________