First your pads design is not the same across the 3 points on the PCB, secondly the wire (high AWG) stressed the solder joints. Do tag/put adhesive/epoxy to hold the wires on the PCB so that the stress will be hold down at the epoxy area. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Deng RongJun Sent: Friday, 9 October 2015 4:14 PM To: [log in to unmask] Subject: [TN] Solder joint peel off from ENIG board Hi all: I have got a solder joint strength issue on ENIG board, the cables soldered on board can be easily detach from pads by a small external force(1kg), the cable mounting process is hand soldering. Failure rate is about 20%. We have made SEM and EDS test for solder joint and peel off surface, P Wt% is high than normal. And we have also made SEM test for 10pcs bare board, the Au thickness is 0.038-0.05um, Ni thickness is 2.8-4.0um. As I know high P Wt% will affect solder joint strength, what issue is happened during PCB fabrication process? Anybody know anything about this? Here comes pictures: http://pan.baidu.com/s/1sjl7Ynb Best regards Deng ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________