There are several methods one can use, depending on what is underneath the solder mask. Some of the methods are mechanical abrasion via hand tool or pneumatically-driven shells/abrasives. One can use different materials or masks to help define the area. There are also chemical means as well as precision means via laser sources. Most of these techniques are outlined in IPC 7711/7721. Regards Bob/BEST On Thu, Oct 1, 2015 at 10:56 AM, Victor Hernandez < [log in to unmask]> wrote: > Fellow TechNetters: > > I have been asked to see if that is a satisfactory method for > removing/stripping solder mask from sample coupons chemically and/or > mechanically. > > Victor, > > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > -- Bob Wettermann BEST Inc [log in to unmask] Cell: 847-767-5745 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________