There are several methods one can use, depending on what is underneath the
solder mask.

Some of the methods are mechanical abrasion via hand tool or
pneumatically-driven shells/abrasives. One can use different materials or
masks to help define the area. There are also chemical means as well as
precision means via laser sources.

Most of these techniques are outlined in  IPC 7711/7721.

Regards

Bob/BEST

On Thu, Oct 1, 2015 at 10:56 AM, Victor Hernandez <
[log in to unmask]> wrote:

> Fellow TechNetters:
>
>    I have been asked to see if that is a satisfactory method for
> removing/stripping solder mask from sample coupons chemically and/or
> mechanically.
>
> Victor,
>
>
> ______________________________________________________________________
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-- 
Bob Wettermann
BEST Inc
[log in to unmask]
Cell: 847-767-5745


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