10 microns thick layer is a perfect way for a disaster down the road :-). There are no parameters for E-Ni, but the appearance of the interface and a P-enriched layer is important. Vladimir Sent from my BlackBerry 10 smartphone on the Rogers network. Original Message From: Victor Hernandez Sent: Wednesday, September 16, 2015 10:11 To: [log in to unmask] Reply To: TechNet E-Mail Forum Subject: Re: [TN] BGA Reworked Intermetallic On ENIG surface I don't see much of an increase in the IMC formation thickness. However, on Cu it is a different story. I have measured IMC formation greater tham 10 microns. Not sure of the below statement about E-NI parameter. Please explain!!! Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev Sent: Wednesday, September 16, 2015 8:12 AM To: [log in to unmask] Subject: Re: [TN] BGA Reworked Intermetallic The "magic" Number should stay the same 1-3 micron but you'd also have to keep an eye on what happened to the layer of E-Ni underneath. Regards, Vladimir SENTEC Sent from my BlackBerry 10 smartphone on the Rogers network. Original Message From: Datacom - Juliano Ribeiro Sent: Wednesday, September 16, 2015 09:09 To: [log in to unmask] Reply To: TechNet E-Mail Forum Subject: [TN] BGA Reworked Intermetallic Hi to all, When we reworked the BGA, removed the component of the board and replacement another BGA, what's the intermetallic thickness ideal after the rework? p.s: Our pcb is ENIG finished and the solder is Tin Lead. _____________________________ Juliano Bettim Ribeiro DATACOM ENGENHARIA DE PROCESSOS Rua América Nº 1000 - Eldorado do Sul - RS CEP: 92990-000 +55 (51) 8446-2135 +55 (51) 3933-3000 Ramal: 3484 [log in to unmask] www.datacom.ind.br ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________